変更日時:
7月 07,2021
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ｻﾌﾟﾗｲﾔ部品番号:
TIM_Gap_Filler
名前: Thermal Gap Filler 説明:
Laird gap filler pads are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system. The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance.
Laird’s extensive gap filler product lines includes:
Products ranging from 1-34 W/mk Thermal conductivity
Thickness ranges from 0.25mm to 5mm
High Deflection Series (Tflex HD300, Tflex HD700, Tflex HD8000, and Tflex HD90000)
Industries:
Consumer Electronics
Automotive
Telecom
Data Infrastructure
Industrial
Aerospace & Defense
Website Link: Product Catalog Page
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Laird Technologies
Laird enables and protects the sensitive electronic components that power the world’s most sophisticated devices and machines. We partner with leading technology brands to deliver custom-engineered thermal interface materials, microwave absorbers, precision metals, EMC components, and EMI suppression solutions. Our product portfolio enhances the performance and reliability of electronics, including wearable devices, personal computers, servers, MRI machines, automobiles, 5G base stations, smart meters and much more.
Laird Technologies 16401 Swingley Ridge Road Suite 700
Chesterfield , Missouri , 63017 United States
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